Union Electronics and IT Minister Sh. Ashwini Vaishnaw announced the approval of first trench of 7 projects under the Electronics Components Manufacturing Scheme (ECMS). Now Multi-Layer Printed Circuit Boards (PCBs) , HDI PCBs, Camera Modules, Copper Clad Laminates, and Polypropylene Films will be Made in India. The move marks a major step in India’s journey from making finished products to manufacturing modules, components, materials & machineries used to manufacture them.
Overwhelming response for ECMS
The scheme has received wonderful response from both domestic and global companies. 249 applications have been received. These represents Rs 1.15 lakh crore investment, Rs 10.34 lakh crore production, and 1.42 lakh jobs to be created. It is the highest-ever investment commitment in India’s electronics sector.
Today marks the approval for seven projects worth Rs 5,532 crore. These projects will lead to production of components worth Rs 36,559 crore and creation of over 5,100 direct jobs.
The approved units are spread across Tamil Nadu (5), Andhra Pradesh (1), and Madhya Pradesh (1). This reinforces the balanced regional growth and expanding high-tech manufacturing beyond metros.
|
Applicant Name |
Product |
Location |
Investment (Rs Crore) |
|
Kaynes Circuits India Pvt. Ltd. |
Multi-layer Printed Circuit Board (PCB) |
Tamil Nadu |
104 |
|
Kaynes Circuits India Pvt. Ltd. |
Camera Module Sub-Assembly |
Tamil Nadu |
325 |
|
Kaynes Circuits India Pvt. Ltd. |
HDI PCB |
Tamil Nadu |
1,684 |
|
Kaynes Circuits India Pvt. Ltd. |
Laminate |
Tamil Nadu |
1,167 |
|
SRF Ltd. |
Polypropylene Film |
Madhya Pradesh |
496 |
|
Syrma Strategic Electronics Pvt. Ltd. |
Multi-layer Printed Circuit Board (PCB) |
Andhra Pradesh |
765 |
|
Ascent Circuits Pvt. Ltd. |
Multi-layer Printed Circuit Board (PCB) |
Tamil Nadu |
991 |
|
Total |
|
|
5,532 |
Product details
The approved projects cover key components like High-Density Interconnect (HDI) PCBs, Multi-Layer PCBs, Camera Modules, Copper Clad Laminates, and Polypropylene Films.
Camera modules are compact imaging units that capture photos and videos in electronic devices. Its production in India will enable its usage in smartphones, drones, laptops, tablets, medical instruments, robots, and automotive systems.
HDI and Multi-Layer PCBs are the core circuit boards that connect and control every electronic device. These are used in smartphones, laptops, automotive and industrial systems.
Strategic Breakthroughs in Base Materials
ECMS also marks India’s strong entry into component materials manufacturing.
For the first time, India will establish a Copper Clad Laminate (CCL) manufacturing facility. CCL acts as a base component for manufacturing Multi-layer PCBs. These PCBs go into every electronic equipment. Right now it is imported.
The Polypropylene Films is the key material used in manufacturing capacitors. This component will be made in India for Consumer Electronics, Automotive, ICT, Industrial & Manufacturing, Telecommunications & Computing equipment’s.
Economic and Industrial Impact
- These projects will reduce import dependence and and lower product prices in the domestic market
- These projects will create high-skill jobs in manufacturing and R&D
- Trusted supply chains will be built for defense, telecom, EVs, and renewable energy
India is on its journey towards becoming a product nation, capable of designing, manufacturing, and exporting end-to-end electronic equipment. The scheme complements PLI and the India Semiconductor Mission (ISM). It completes the seamless value chain, from devices to chips, components to materials, and from manufacturing to innovation.
