Vedanta Foxconn JV, IGSS Ventures, ISMC propose to set-up electronic chip manufacturing plants with USD 13.6 billion investment and have sought support of USD 5.6 billion from the Centre under the Rs 76,000 crore Semicon India Programme.
The applications have been received for setting up 28 nm to 65 nm semiconductor fabs with capacity of approximately 1,20,000 wafers per month. The government is providing financial support of up to 40 percent for chips above 28 nm to 45 nm and up to 30 percent for setting up manufacturing units for 45 nm to 65 nm wafers.
Vedanta and Elest have proposed to set up display manufacturing units — used in mobile phones, laptops etc — with projected investment of USD 6.7 billion. They have sought support of USD 2.7 billion from the Centre under the scheme for setting up of display fabs in India, the statement said.
The government expects investments of around Rs 1.7 trillion and 1.35 lakh jobs to be created in the next four years under the incentive scheme for semiconductors approved by the Union Cabinet.
Besides electronic chip and display plants, four companies — SPEL Semiconductor, HCL, Syrma Technology and Valenkani Electronics — have registered for semiconductor packaging. Ruttonsha International Rectifier has registered for compound semiconductors.
Three companies — Terminus Circuits, Trispace Technologies and Curie Microelectronics — have submitted applications under the Design Linked Incentive Scheme.